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STRUCTURAL ADHESIVES The Protavic line of adhesives is used in demanding applications such as semiconductor die attach to electrical wire stacking. We have fast and slow setting materials that provide excellent resistance to chemical attach, offer high bond strength and are easy to use. Whether you require hard, soft, one or two part systems, we have the right product for you. Give us a call if you cannot locate a product that meets your needs.Benefits · High Shear Strength· Low moisture absorption · low modulus materials · Ability to handle lead free temperatures · Products marked with an asterisk(*) are MixPac™-compatible |
| Product | Description | Mix Ratio | Mixed Viscosity | Lap Strength / PSI | Operating Temp. °C |
| ANE-26144 * | Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Non-hazardous and safe to use. Requires heat assist to cure. | 10:1 | 7,000 | 3,200 | -55 to +180 |
| ANE-17794 | Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous and safe to use. Requires heat assist to cure. | No catalyst Required | 5,000 | 2,600 | -55 to +175 |
| ANE-47927 * | Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures. | 2:1 | 50,000 | 3,000 | -60 to +140 |
| ANE-57103 * | Fast cure (10 minute) epoxy system. Excellent stacking and fixturing. This material is toughened for outstanding thermal shock resistance. | 1:1 | 10,000 | 4,500 | -50 to +130 |
| ANE-47932 * | Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist. | 1:1 | 40,000 | 3,200 | -60 to +180 |
| ANE-46505 * | Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time. Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. | 1:1 | 30,000 | 3,800 | -55 to 140 |
| ANE-46515 * | Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and higher or lower viscosities. Passes NASA outgassing requirements. | 1:1 | 40,000 | 4,500 | -55 to +140 |
| ATE-46446 | Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm⁰K thermal performance with supporting laser flash data. Room temperature cure. | 100:9 (weight) |
8,000 | 4,200 | -55 to +175 |
| ATE-10120 | Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm⁰K. Often used as a die & lid attach material. Requires low heat assist for cure. Ideal for applications requiring low-heat curing. | No catalyst Required | 10,000 | 3,000 | -55 to +155 |
| PNU-56200 * | Amber urethane system. Offers a fast (5-minute) cure and bonds well to metal, leather, vinyl and wood. Electronics grade, often used for wire stacking. This material is flexible yet tough enough to handle vibration applications.formerly EGA-200 | 1:1 | 5,000 | 2,000 | -55 to +120 |
| PNU-46202 * | Water Clear urethane system. This material does not yellow and can be used for bonding plastic, glass, and many other types of substrates. It is excellent for applications requiring flexibility. Gel time is 10 minutes. | 1:1 | 5,000 | 2,000 | -55 to +120 |
| ANE-10931 | Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications. | No catalyst Required | 25,000 | 3,000 | -55 to +200 |
| ANE-20904 | Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. | No catalyst Required | 25,000 | 2,000 | -55 to + 120 |
| ANE-10700 | Epoxy system designed as a no- flow underfill material that can be used for any application where high reliability and fast cure is required. This material is commonly used for bonding microchips on RFID antennas and other die-attach applications. This material offers an 8-hour pot life and requires less than 10 seconds to cure. | No catalyst Required | 8,000 | 2,000 | -55 to +200 |
| IMPORTANT: The information contained in this data sheet corresponds to the present state of our knowledge; it is intended for your guidance but we are not bound by it since we are not in the position to exercise control over the manner in which our products are used. Moreover, the attention of the user is drawn to the risks that could occur should a product be used for an application other than for which it is intended. | ©2007. All rights reserved. Tel: (800) 807 2294 Fax: (800) 807 2294 info@protavicamerica.com | ||||